Three-dimensional Integrated Circuit Design > Chapter 1: Introduction

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Three-dimensional Integrated Circuit Design

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Table of Contents

Front Cover

Three-Dimensional Integrated Circuit Design

Chapter 1: Introduction

1.1. From the Integrated Circuit to the Computer

1.2. Interconnects, an Old Friend

1.3. Three-Dimensional or Vertical Integration

1.4. Book Organization

Chapter 2: Manufacturing of 3-D Packaged Systems

Chapter 3: 3-D Integrated Circuit Fabrication Technologies

Chapter 4: Interconnect Prediction Models

Chapter 5: Physical Design Techniques for 3-D ICs

Chapter 6: Thermal Management Techniques

Chapter 7: Timing Optimization for Two-Terminal Interconnects

Chapter 8: Timing Optimization for Multiterminal Interconnects

Chapter 9: 3-D Circuit Architectures

Chapter 10: Case Study: Clock Distribution Networks for 3-D ICs

Chapter 11: Conclusions

Appendix A: Enumeration of Gate Pairs in a 3-D IC

Appendix B: Formal Proof of Optimum Single Via Placement

Appendix C: Proof of the Two-terminal Via Placement Heuristic

Appendix D: Proof of Condition for Via Placement of Multiterminal Nets

References

Index

Chapter Introduction Electronics has experienced tremendous growth over the past century. During this time period, the use of electronic merchandise has steadily increased while the size of these products has decreased. The transition from micro- to nano-scale has further enhanced the applicability of electronic products into new areas, which were previously precluded 1

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Chapter 1: Introduction - Pg. 1