Three-dimensional Integrated Circuit Design > Chapter 11: Conclusions > Chapter 11: Conclusions - Pg. 278: Safari Books Online

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Three-dimensional Integrated Circuit Design

Three-dimensional Integrated Circuit Design

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Contents

Table of Contents

Three-Dimensional Integrated Circuit Design

Dedication Page

Acknowledgments

Chapter 1: Introduction

Chapter 2: Manufacturing of 3-D Packaged Systems

Chapter 3: 3-D Integrated Circuit Fabrication Technologies

Chapter 4: Interconnect Prediction Models

Chapter 5: Physical Design Techniques for 3-D ICs

Chapter 6: Thermal Management Techniques

Chapter 7: Timing Optimization for Two-Terminal Interconnects

Chapter 8: Timing Optimization for Multiterminal Interconnects

Chapter 9: 3-D Circuit Architectures

Chapter 10: Case Study: Clock Distribution Networks for 3-D ICs

Chapter 11: Conclusions

Appendix A: Enumeration of Gate Pairs in a 3-D IC

Appendix B: Formal Proof of Optimum Single Via Placement

Appendix C: Proof of the Two-terminal Via Placement Heuristic

Appendix D: Proof of Condition for Via Placement of Multiterminal Nets

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