CHAPTER Fabrication Aspects of Integrated Devices CHAPTER OUTLINE HEAD 4 4.1 Methods for Image Formation...........................................................................................................100 4.1.1 ElectronBeamDirectWriteLithography .................................................................... 100 . 4.1.2 AtomicForceMicroscopicNanolithography................................................................ 101 4.1.3 OpticalMask-LessLithography ................................................................................. 102 . 4.1.4 CopyingExpositionMethods..................................................................................... 103 4.1.5 ExtremeUltravioletLithography(EUV)....................................................................... 104 4.2 Methods to Pattern Surfaces ............................................................................................................104 4.2.1 ChemicalEtching.................................................................................................... 104 4.2.2 DeepReactive-IonEtching(DRIE) ............................................................................ 104 . 4.2.3 NanoimprintLithography.......................................................................................... 105 4.2.4 Magneto-Lithography(ML) ....................................................................................... 106 . 4.2.5 LIGAProcess........................................................................................................... 106 4.2.6 DepositionwithLift-Off............................................................................................ 107