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C > CONDUCTOR LAYER - Pg. 69

CONE OF TOLERANCE and economic basis for the program, and concept feasibility, are established through pertinent studies. CONCEPTUAL DESIGN DATA Data, such as drawings or 3D solid models, that describe the engineering concepts on which a proposed technology or design approach is based. CONCEPTUAL DESIGN DRAWINGS Drawings that describe the engineering concepts on which a proposed technology or design approach is based. CONDITIONING Time-limited exposure of a test specimen to a specified environment prior to testing. CONDUCTED INTERFERENCE Undesired signals that enter or leave equipment along a conductive path. CONDUCTIVE FOIL A thin sheet of metal that may cover one or both sides of the base material and is intended for forming the con- ductive pattern. CONDUCTIVE PATTERN The configuration or design of the conductive material on the base material. (Includes conductors, lands, and through connections when these connections are an inte- gral part of the manufacturing process.) CONDUCTOR (1) A single conductive path in a conductive pat- tern. (2) A wire or combination of wires not insulated from one another, suitable for carrying current. CONDUCTOR BASE WIDTH The conductor width at the plane of the surface of the base material. CONDUCTOR LAYER The total conductive patterns formed upon one side of a single layer of base material. CONDUCTOR PATTERN See Conductive pattern. CONDUCTOR SPACING The distance between adjacent edges (not centerline to centerline) of isolated conductive patterns in a conductor layer. CONDUCTOR THICKNESS The thickness of the conductor including all metallic coatings. (It excludes nonconductive protec- tive coatings.) CONDUCTOR WIDTH The observable width of a conductor at any point chosen at random on the printed board, normally viewed vertically from above unless otherwise specified. (Imperfections-- for example, nicks, pinholes, or scratches--allowable by the rele- vant specifications shall be ignored.) CONE OF TOLERANCE The specification of tighter test toler- ances at the factory (or at component or subassembly indenture lev- 69