T o our friends and families for their patience and understanding, and especially Carolyn McKenna for her encouragement and support. Characterization of Integrated Circuit Packaging Materials Copyright © Momentum Press, LLC, 2010 All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means--electronic, mechanical, photocopy, recording or any other except for brief quotations, not to exceed 400 words, without the prior permission of the publisher. First published by Butterworth-Heinemann in 1993 Copyright ©1993, by Butterworth-Heinemann, a division of Reed-Elsevier, Inc. Reissued volume published in 2010 by Momentum Press ® , LLC 222 East 46 th Street, New York, N.Y. 10017 www.momentumpress.net ISBN-13: 978-1-60650-187-0 ISBN-10: 1-60650-187-9 ISBN-13: 978-1-60650-189-4 ISBN-10: 1-60650-189-5 DOI forthcoming (hard back, case bound) (hard back, case bound) (e-book) (e-book)